JPH01303729A - 混成集積回路における半導体チップの樹脂モールド方法 - Google Patents
混成集積回路における半導体チップの樹脂モールド方法Info
- Publication number
- JPH01303729A JPH01303729A JP63132640A JP13264088A JPH01303729A JP H01303729 A JPH01303729 A JP H01303729A JP 63132640 A JP63132640 A JP 63132640A JP 13264088 A JP13264088 A JP 13264088A JP H01303729 A JPH01303729 A JP H01303729A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- elastic body
- hole
- semiconductor chip
- sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 title claims abstract description 64
- 229920005989 resin Polymers 0.000 title claims abstract description 64
- 238000000465 moulding Methods 0.000 title claims abstract description 18
- 239000004065 semiconductor Substances 0.000 title claims description 31
- 238000000034 method Methods 0.000 claims abstract description 25
- 239000007788 liquid Substances 0.000 claims description 7
- 238000003825 pressing Methods 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 abstract description 10
- 235000011837 pasties Nutrition 0.000 abstract 1
- 230000001681 protective effect Effects 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 238000004806 packaging method and process Methods 0.000 description 5
- 230000035939 shock Effects 0.000 description 5
- 239000004020 conductor Substances 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 238000007796 conventional method Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 241000238413 Octopus Species 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63132640A JPH01303729A (ja) | 1988-06-01 | 1988-06-01 | 混成集積回路における半導体チップの樹脂モールド方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63132640A JPH01303729A (ja) | 1988-06-01 | 1988-06-01 | 混成集積回路における半導体チップの樹脂モールド方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01303729A true JPH01303729A (ja) | 1989-12-07 |
| JPH0532903B2 JPH0532903B2 (en]) | 1993-05-18 |
Family
ID=15086056
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63132640A Granted JPH01303729A (ja) | 1988-06-01 | 1988-06-01 | 混成集積回路における半導体チップの樹脂モールド方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01303729A (en]) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR0182543B1 (ko) * | 1995-04-07 | 1999-03-20 | 김광호 | 전자렌지의 조명장치 및 그 제어방법 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS548680U (en]) * | 1977-06-21 | 1979-01-20 | ||
| JPS6352428A (ja) * | 1986-08-22 | 1988-03-05 | Olympus Optical Co Ltd | 半導体素子の製造方法 |
-
1988
- 1988-06-01 JP JP63132640A patent/JPH01303729A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS548680U (en]) * | 1977-06-21 | 1979-01-20 | ||
| JPS6352428A (ja) * | 1986-08-22 | 1988-03-05 | Olympus Optical Co Ltd | 半導体素子の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0532903B2 (en]) | 1993-05-18 |
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